Unmodified medium molecular weight solid epoxy resin based on bisphenol A. Available in flake form.
Suitable for formulation of powder coatings when cured with variety of curing agents such as phenolic resins, Novolacs, acid anhydride, saturated polyesters and dicyandiamide
HSC 2302 is unmodified low molecular weight solid epoxy resin based on bisphenol A. Available in solid lump form.
Unmodified high molecular weight solid epoxy resin based on bisphenol A. Available in flake form. It is mainly used to make single pack, baking type epoxy-amino, epoxy-phenolic coatings that are used in packaging industry. This product can also be used in the manufacturing of epoxy esters, to produce industrial protective coatings. The high hydroxyl content of HSC 2304 can be used to prepare ambient, polyisocyanate curable, 2K system.
HSC 2304 has higher softening point. This property imparts good hardness to the coating. It can be used for one pack stoving enamels in combination with amino type hardeners and melamine. Enamels from HSC 2304 are good for verity of exterior and interior coatings of tubes, cans, coils, and drums. The film shows high glass transition temperature, adhesion coupled with chemical resistance, exceptional flexibility.