Formulated Resins

Resin HSC 7100 (Unmodified Epoxy Resin

 

Product Description 

Unmodified medium viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A.

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) and at elevated temperature cure conditions (Anhydrides or other catalytic curing agent).

Features

  • Good chemical resistance, Good thermal resistance, Excellent adhesion, Excellent mechanical and electrical properties, Good pigment wetting.

Applications

  • Adhesive, casting and tooling, civil and building, composites, solvent free and high solids coatings, marine and protective coating, potting and encapsulation.
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Resin HSC 7101

 

Product Description 

Unmodified medium viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A.

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) and at elevated temperature cure conditions (Anhydrides or other catalytic curing agent).

Features

  • Good chemical resistance,
  • Good thermal resistance,
  • Excellent adhesion,
  • Excellent mechanical and electrical properties,
  • Good pigment wetting.

Applications

  • Adhesive,
  • casting and tooling,
  • civil and building,
  • composites,
  • solvent free and high solids coatings,
  • marine and protective coating,
  • potting and encapsulation.
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Resin HSC 7111
(Modified Epoxy Resin)

Product Description 

HSC 7111 is thixotropic high viscosity resin.

Features

  • • No VOC are liberated during the course of reaction superior mechanical, thermal and electrical strength.

Applications

  • Rail glue Joint
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Resin HSC 7112
(Modified Epoxy Resin)

 

Product Description 

HSC 7112 is high viscosity filled epoxy resin. 7112/8112 is multipurpose Room Temperature curing high strength adhesive for variety of applications like metal, glass, rigid plastic etc. 

Features

  • No VOC are liberated during the course of reaction superior mechanical, thermal and electrical strength.

Applications

  • Multipurpose high toughness adhesive applications.
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Resin HSC 7200
(Unmodified Medium Viscosity Liquid Epoxy Resin)

Product Description 

Unmodified medium viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A. 

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) and at elevated temperature cure conditions (Anhydrides or other catalytic curing agent).

Features

  • No VOC are liberated during the course of reaction superior mechanical, thermal and electrical strength.

Applications

  • Adhesive,
  • casting and tooling,
  • civil and building,
  • composites,
  • solvent free and high solids coatings,
  • marine and protective coating,
  • potting and encapsulation.
Download TDS

Resin HSC 7249
(Low Viscosity Modified Epoxy Resin)

 

Product Description 

HSC 7249 low viscosity modified epoxy resin for various FRP applications. The convenient mixing ratios and low mix viscosity of system permits good filler loading and exhibit great mechanical properties. 

Features

  • The system gives superior substrate wetting, long pot life, low exotherm and superior mechanical properties.

Applications

  • Specially use for Pultrusion and Filament Winding Application
  • FRP hand layup Application
  • Maintenance of civil structure.
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Resin HSC 7250
(Modified Epoxy Resin)

 

Product Description 

HSC 7250 is Low viscosity reactive diluent modified epoxy resin Best suited with Polyamidoamine for primers, cycloaliphatic amine adducts and polyether amines for top coats.

Features

  • The resin offers good chemical resistance, excellent adhesion to substrates.
  • Excellent mechanical properties and good pigment wetting.
  • The resin has low tendency to crystallize.

Applications

  • Civil and building for solvent free coatings, various screed and mortar applications.
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Resin HSC 7251
(Low Viscosity Modified Epoxy Resin)

 

Product Description 

HSC 7251 low viscosity modified epoxy resin for variety of application including lamination, civil and electrical potting. The resin is utilized with various amines, cycloaliphatic amines and polyaminoamides for variety of applications. 

Features

  • The system offers very low initial mix viscosity which provides excellent fibre wetting in case of lamination and better filler loading in case of screed and electrical potting applications.
  • The resin offers negligible shrinkage, intramolecular stresses and excellent hydrophobicity when used with various type of hardeners.

Applications

  • Filament winding, pultrusion of structure and industrial composites like electrical laminates.
  • Electrical potting of low voltage devices.
  • Primer and top coat applications for civil and building sectors.
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Resin HSC 7361
(Modified Epoxy Resin)

 

Product Description 

HSC 7361 is low viscosity modified epoxy resin for marble and granite coating applications. HSC 7361/HSC 8290 is moderate reactivity system and provides high gloss and impregnation on surface of stone. 

Features

  • Slow reactivity leading to good resin absorbance on marble; Superior gloss and color retention; Oven curing at < 50°C which ensure energy saving.

Applications

  • Marble coating applications.
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Resin HSC 7400
(Unmodified Epoxy Resin)

 

Product Description 

Unmodified medium viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A. 

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) and at elevated temperature cure conditions (Anhydrides or other catalytic curing agent).

Features

  • Good chemical resistance,
  • Good thermal resistance,
  • Excellent adhesion,
  • Excellent mechanical and electrical properties,
  • Good pigment wetting.

Applications

  • Adhesive,
  • casting and tooling,
  • civil and building,
  • composites,
  • solvent free and high solids coatings,
  • marine and protective coating,
  • potting and encapsulation
Download TDS

Resin HSC 7450
(Low viscosity liquid epoxy resin)

 

Product Description 

HSC 7450 is Low viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A.

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) 

Features

  • The resin offers good chemical resistance, excellent adhesion to substrates, excellent mechanical properties and good pigment wetting
  • The resin has low tendency to crystallize

Applications

  • Civil and building for solvent free coatings.
  • Various screed and mortar applications.
Download TDS

Resin HSC 7451
(Low viscosity liquid epoxy resin)

 

Product Description 

HSC 7451 is Low viscosity reactive diluent modified epoxy resin.

Best suited with Polyamidoamine for primers, cycloaliphatic amine adducts and polyether amines for top coats.

Features

  • The resin offers low viscosity which enhances the filler loading capacity & low surface tension thus improving adhesion by better substrate wetting, good color retention in top coat and good pigment wetting & dispersibility.
  • The resin has low tendency to crystallize.

Applications

  • Civil and building for solvent free coatings.
  • Various screed and mortar applications, best utilized for self-levelling floorings.
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Resin HSC 7454 (Modified Epoxy Resin)

Product Description 

HSC 7454 low viscosity modified epoxy resin for various civil applications.
The convenient mixing ratios and low mix viscosity of HSC 7454/HSC 8230 system permits good filler loading and exhibit great mechanical properties.

Features

  • The system gives superior substrate wetting, good mechanical strength and chemical resistance with enhancement in bonding strength. The system has less toughness compared to HSC 7450.

Applications

  • Flooring primer and screed applications,
  • maintenance of old civil structures and injection grouting.
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Resin HSC 7456
(Modified Epoxy Resin)

 

Product Description 

HSC 7456 is low viscosity modified epoxy resin for variety of application including lamination, civil and electrical. The resin is utilized with various amines, cycloaliphatic amines and polyamides for different applications.

Features

  • The system offers very low initial mix viscosity which provides excellent fibre wetting in case of lamination and better filler loading in case of screed and electrical potting applications.
  • The resin offers negligible shrinkage, intramolecular stresses and excellent hydrophobicity when used with various type of hardeners.

Applications

  • Solvent free Primer and top coat applications for civil and building sectors.
  • Screed and grouts application
  • Crack repair and filling application.
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Resin HSC 7550
(Modified Epoxy Resin)

 

Product Description 

HSC 7550 is modified epoxy resin to serve electrical casting and VPI systems.

Features

  • The system offers low initial mix viscosity which provides excellent impregnations in cores and superior filler loading in castings which eventually yields superior mechanical properties and electrical properties. The system offers negligible shrinkage, intramolecular stresses and excellent hydrophobicity.

Applications

  • Indoor electrical castings, VPI of transformers and cores.
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Resin HSC 7560
(Modified Epoxy Resin)

 

Product Description 

HSC 7560 is a low viscosity modified epoxy resin to serve electrical potting & casting applications.

Features

  • Permits good filler loading and exhibits superior mechanical, electrical and thermal properties.

 

Applications

  • Serve electrical potting & casting applications
  • Potting and encapsulation of low voltage electrical and electronic components like CDI, Flashers, ignition coils, charging coils, igniters, capacitors, rectifiers, etc
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Resin HSC 7651
(Modified Epoxy Resin)

 

Product Description 

HSC 7651 is modified epoxy resin to serve composite application with hardener HSC 8210 which is low viscosity aliphatic amine hardener to offer a short pot life. 

Features

  • The system offers low initial mix viscosity which helps in achieving excellent fibre wetting and eventually superior mechanical properties.
  • The system has negligible shrinkage and intramolecular stresses and excellent hydrophobicity.

Applications

  • General purpose laminates by hand lay-up or moulding processes for industrial and structural composites, Filament winding, pultrusion of structure and industrial composites like electrical laminates.
Download TDS

Resin HSC 7660
(Modified Epoxy Resin)

 

Product Description 

HSC 7660 is modified epoxy resin to serve composite application with hardener HSC 8210 which is low viscosity aliphatic amine hardener to offer a short pot life. 

Features

  • The system offers low initial mix viscosity which helps in achieving excellent fibre wetting and eventually superior mechanical properties.
  • The system has negligible shrinkage and intramolecular stresses and excellent hydrophobicity.

Applications

  • General purpose laminates by hand lay-up or moulding processes for industrial and structural composites, Filament winding, pultrusion of structure and industrial composites like electrical laminates.
Download TDS

Resin HSC 7661
(Modified Epoxy Resin)

 

Product Description 

HSC 7661 is modified epoxy resin to be used for manufacturing of prepregs.

Features

  • The system offers low initial mix viscosity which helps in achieving excellent fibre wetting. The low initial colour of the system ensures a good colour of the fibre composite.
  • The systems are designed to give long working time required for proper wetting of larger size laminates.  B-Stage may be carried out at elevated temperatures of order of 60-80°C to accelerate the curing process. Post curing facilitates Tg achievement.

 

Applications

  • Laminates by prepreg techniques.
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Resin HSC 7662
(Modified Medium Viscosity Epoxy Resin)

 

Product Description 

Modified medium viscosity liquid epoxy resin derived from epichlorohydrin and bisphenol A.

Various curing agents are available to cure liquid epoxy resins like at ambient cure conditions (Polyamines, polyamides, amidoamines, cycloaliphatic amines, phenalkamines etc.) and at elevated temperature cure conditions (Anhydrides or other catalytic curing agent).

Features

  • This resin offers excellent fibre wetting and eventually superior mechanical properties, electrical properties and thermal resistance with negligible shrinkage, intramolecular stresses and excellent hydrophobicity.

Applications

  • Filament winding, pultrusion of structure and industrial composites like electrical laminates.
Download TDS

Resin HSC 7750
(Ambient curing epoxy resin)

 

Product Description 

HSC 7750 is solvent free clear high viscous bisphenol A based resin designed for multipurpose application. 

Features

  • With proper curing agent the HSC 7750 used as a versatile adhesive having good shear strength.

Applications

  • Suitable for adhesive, casting, sealing, dipping, laminating etc. with proper curing agents.
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