Product Description
Unmodified medium molecular weight solid epoxy resin based on bisphenol A. Available in flake form.
Suitable for formulation of powder coatings when cured with variety of curing agents such as phenolic resins, Novolacs, acid anhydride, saturated polyesters and dicyandiamid
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Applications:
Product Description
Unmodified medium molecular weight solid epoxy resin based on bisphenol A. Available in flake form.
Suitable for formulation of powder coatings when cured with variety of curing agents such as phenolic resins, Novolacs, acid anhydride, saturated polyesters and dicyandiamid
Key Properties:
Applications:
Product Description
HSC 2302 is unmodified low molecular weight solid epoxy resin based on bisphenol A. Available in solid lump form.
Features
Applications
Product Description
HSC 2303 is unmodified low molecular weight solid epoxy resin based on bisphenol A. Available in semi-solid form and flowable at elevated temperatures. This grade is developed for use in coal-tar extended, heavy duty and protective coatings.
Features
Applications
Product Description
Unmodified high molecular weight solid epoxy resin based on bisphenol A. Available in flake form.
It is mainly used to make single pack, baking type epoxy-amino,epoxy-phenolic coatings. This product can also be used in the manufacturing of epoxy esters, to produce industrial protective coatings. The high hydroxyl content of HSC 2305 can be used to prepare ambient, polyisocyanate curable, 2K system. HSC 2305 are good for metal decoration, verity of exterior and interior coatings of tubes, cans, coils, drums and other industrial applications.
Key Features
Applications
Product Description
Unmodified medium molecular weight, solid epoxy resin based on bisphenol A. HSC 2321 is type-2 solid epoxy resin and available in flake form.
This grade is recommended for directly epoxy systems as well as for making epoxy ester resins to obtain better gloss and required mechanical properties
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Applications
Product Description
HSC 2500 is solid epoxy resin based of Bis-Phenol A for electrical insulation applications.
Key Features
Applications
Product Description
Unmodified medium molecular weight, solid epoxy resin based on bisphenol A. Available in flake form. HSC 2342 has Molecular weight and viscosity in between type 3 & Type 4 Bis A epoxy resins, which allows it to give optimum performance in all type of powder coating applications.
Key Features
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Product Description
Unmodified medium molecular weight, solid epoxy resin based on bisphenol A. HSC 2343 is type-4 solid epoxy resin and available in flake form. This grade is recommended for directly epoxy systems as well as for making epoxy ester resins by reacting with appropriate amounts of fatty acids using suitable catalysts.
Key Features
Applications
Product Description
HSC 2306 is unmodified high molecular weight solid epoxy resin based on bisphenol A. Available in flake form. HSC 2306 has higher softening point and can be cured with amino or phenolic resins for use in the below applications:
Key Features
Applications