Product Description
75% solution of Type 1 solid epoxy resin in xylene
Suitable for formulation of solvent borne 2 component coatings with various curing agents like polyamines, polyamide, phenalkamines and various amine adducts
Features
Application:
Product Description
80% solution of Type 1 solid epoxy resin in MEK
Suitable for formulation of solvent borne 2 component coatings with various curing agents like polyamines, polyamide, phenalkamines and various amine adducts.
Features
Applications